Hiring for Dry Etch Process Engineer in Chandigarh, for Exp. 5 - 10 yrs at Orbit Technologies.

  • Esteemed client of Orion TrueTech Services India
  • Chandigarh, Punjab, India
  • May 16, 2018
Full time Others

Job Description

Job Description:***ONLY CANDIDATES WITH INTERNATIONAL FAB EXPERIENCE WILL BE CONSIDERED*** 1.Required to have minimum 5 years relevant experience in semiconductor wafer fabrication plants with deep understanding of Dry tools and wafer fabrication processes. 2.Expert with Dry Etch tool sets: KIYO tool sets, VERSYS METAL tool sets , SYNDION tool sets and Flex tool sets 3.Provides technical support to field engineers, technicians, and product support personnel who are diagnosing, troubleshooting, repairing and debugging complex electro/mechanical equipment, computer systems, complex software, or networked and/or wireless systems. 4.Provide support to customer engineers working on dry etch process development to demonstrate Dry Etch product performance, as well as improvements to existing products and processes. 5.Respond to situations where first-line product support has failed to isolate or fix problems in malfunctioning equipment or software. Reports design, reliability and maintenance problems or bugs to design engineering/software engineering. 6.Operate metrology tools to qualify process equipment and optimize processes, as well as improvements to existing products and processes for Etch process development. 7.May be involved in customer installation and training. Provides support to customer/users where the product is highly technical or sophisticated in nature. 8.Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will facilitate equipment production and sales 9.Sustain dry etch process: minimize HOLD lot turnaround, improve wafer yield, own SPC for all dry etch processes, reduce OOCs, formulate OCAPs and maintain recipe control 10.Dry etch process development: develop processes for NPI(New Product Introductions),drive process efficiency improvements (cycle time improvement, cost reduction) 11.Provide Dry Etch solutions for process integration challenges in cross-functional team environment. 12.Own quality excursions: efficiently identify issue, pipeline, and containment.Report status to Material Review Board 13.Coordinating and transferring process from Lab-to-Fab 14.Travel will be 50% - mostly internationally. 15.In addition to the above Dry etch experience the candidate needs to have general fab experience which includes a.Intimate knowledge and experience with semiconductor wafer fabrication processes and tools. b.Analysis of process deviations and troubleshooting in Production and implement the learning' s for Yield improvement activities. c.Process characterization and optimization using DOE methodology. d.DOE knowledge - Ability to design experiments that meet Design of Experiments standards. e.Ability to work effectively with customers &amp amp amp suppliers f.Good customer interface and communication skills g.Strong fundamental engineering knowledge and the ability to apply it h.Good process troubleshooting skills, in coordination with Integration, Device, equipment team. i.Demonstrated ability to learn quickly, in both process and module. j.Experience or training in statistical process control (SPC) and related tools, software. k.The ability to work independently and in groups to resolve equipment, process and integration related problems. l.A detailed understanding of semiconductor physics, applied chemistry, and processing requirements. m.Knowledge of FEOL process &amp amp amp integration is desirable n.Having Knowledge of integration &amp amp amp device skill will be added advantage. o.Excellent written and oral communication skills. p.Highly self-motivated, and able to work on numerous issues simultaneously, and change focus quickly if needed. q.A willingness and ability to accept responsibility for project completion, project delegation and follow-up. r.Innovative problem-solving skills and Strong multi-tasking skills